Precision Advanced Ceramics — Custom Semiconductor Plasma Etch Focus Ring & Pedestal Base Specialist
Over a decade of dedicated expertise in high-purity advanced technical ceramics. Delivering high-precision engineered ceramic components for global semiconductor fabrication, wafer etching equipment, and precision vacuum systems.
Product Overview
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- Specification Table Summary:
- Alumina Purity: ≥ 99.8% (Al2O3)
- Bulk Density: ≥ 3.92 g/cm³
- Surface Flatness: ≤ 0.003 mm (3 μm, Laser Interferometer Verified)
- Parallelism: ≤ 0.003 mm
- Surface Roughness: Ra 0.2 μm
- Dielectric Strength: 25 kV/mm
- Flexural Strength: ≥ 380 MPa
- Hardness: 1550 HV1 (91 HRA)
- Max Working Temperature: 1400°C Continuous
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Key Selling Points:
Selling Point 1 — Ultra-Precision Surface Flatness Down to 0.003mm (3 μm)
Manufactured via double-disc precision diamond lapping, guaranteeing total surface flatness and parallelism ≤ 0.003mm. Ensures hermetic vacuum sealing, prevents helium cooling backside leakage across electrostatic chucks (ESC), and eliminates wafer thermal gradient warpage.
Selling Point 2 — Extreme Plasma Erosion Resistance & Extended Lifespan
High-purity 99.8% Al2O3 with dense grain boundary packing (density ≥ 3.92 g/cm³) resists aggressive fluorine- and chlorine-based reactive ion etching (CF4, CHF3, Cl2, BCl3). Substantially reduces ring replacement downtime in high-throughput 8"/12" wafer fabs.
Selling Point 3 — Sub-Micron Particle Control & Zero Metal Contamination
Dense microcrystalline ceramic sintering prevents micro-grain spalling under high-energy RF ion bombardment. Trace alkali and heavy metal impurities strictly controlled below semiconductor ppb thresholds, protecting gate oxide and sub-7nm chip yields.
Selling Point 4 — Concentric Labyrinth Arc Grooves & Octagonal Mechanical Keying
Features complex four-quadrant concentric arc labyrinth grooves and anti-rotation octagonal outer profiling. Effectively confines RF plasma sheaths, balances process gas aeration across wafer bevels, and ensures uniform etch depth across entire wafer dies.
Selling Point 5 — Thermal Stability & High Dielectric Isolation
With low coefficient of thermal expansion (CTE 6.8×10⁻⁶/K) and high thermal shock resistance, the ring maintains rigid dimensional stability under cyclic plasma heat. High dielectric breakdown strength (25 kV/mm) prevents electrical arcing between pedestal electrodes.
Selling Point 6 — 100% Optical Metrology & Rapid Prototyping in 3–7 Days
Every component comes with complete CMM geometric coordinate and optical laser interferometer flatness certificates. Supported by strict Non-Disclosure Agreements (NDA), engineering reviews completed within 2 hours.
Structural Breakdown & Geometric Features
- Concentric Labyrinth Arc Grooves: CNC diamond-milled multi-tiered arc channels provide continuous gas aeration and plasma sheath uniformity control.
- Precision Octagonal Profile: Anti-rotation self-aligning chassis geometry ensures repeatable wafer positioning and rigid chamber alignment.
- Rear Counterbore Mounting Pattern: Precision rear flange with tight-tolerance counterbored screw holes allows rigid zero-backlash mounting onto ESC pedestals.
End-to-End Manufacturing & Quality Control
- Step 1: High-Purity CIP Compaction: Ultra-fine sub-micron 99.8% Al2O3 powders shaped under 250 MPa cold isostatic pressing.
- Step 2: 1720°C High-Temperature Sintering: Clean electric atmosphere furnace sintering achieving density ≥ 3.92 g/cm³.
- Step 3: 5-Axis CNC Precision Machining: Diamond milling of concentric labyrinth grooves, center bore, and counterbore mounting patterns.
- Step 4: Double-Disc Diamond Lapping & CMM Inspection: Sub-3μm flatness diamond polishing followed by 100% CMM and laser optical interferometer verification.
Application
Key Semiconductor Equipment Applications
- ICP/CCP Dry Etch Chambers: Wafer edge focus rings, plasma confinement collars, and bottom electrode dielectric shields.
- Electrostatic Chuck (ESC) Assemblies: Insulating ceramic pedestals, gas distribution baffle plates, and helium cooling seal rings.
- PECVD & Atomic Layer Deposition (ALD): High-temperature chamber liners, showerhead gas distribution rings, and anti-plasma protective covers.
- Rapid Thermal Processing (RTP) & Ion Implantation: Thermal-shock proof wafer support rings and high-vacuum beamline beam aperture shields.
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Thermal Conductivity @ 20°C
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Thermal Expansion a at 20–400°C
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Properties
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Unit
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95%Al2O3
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99%Al2O3
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99.5%Al2O3
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Dielectric Constant
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1MHz
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9.4
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9.9
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9.9
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Dielectric Strength
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V/m
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15 x 10 6
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15 x 10 6
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15 x 10 6
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Dielectric Loss
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1MHz
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4 x 10 -4
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4 x 10 -4
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4 x 10 -4
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Volume Resistivity @ 25°C
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Ω・cm
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>10 14
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>10 14
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>10 14
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Volume Resistivity @ 500°C
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Ω・cm
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>10 8
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>10 8
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>10 10
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Packing
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Hunan Yuanhong New Material Co.,Ltd was established in 2016 ,there are over 100 sets of ceramic professional equipments , several types of furnace in more than 8000 square meters production workshops. ISO9001 certified, a variety of advanced ceramic materials are ROHS and REACH certified. |
Q1: How do you guarantee and verify the 0.003mm surface flatness?
A1: Every single ceramic focus ring is measured using dual-disc laser optical interferometry and Zeiss coordinate measuring machines (CMM). A comprehensive metrology inspection report is shipped with every batch.
Q2: Does this 99.8% alumina ceramic resist aggressive fluorine and chlorine plasma gases?
A2: Yes. The dense microcrystalline structure (≥ 3.92 g/cm³) ensures exceptional resistance to CF4, CHF3, SF6, and Cl2 ion sputtering with minimal grain boundary etching.
Q3: What engineering drawing file formats do you accept for quotation?
A3: We accept 3D CAD files in STEP (.stp), IGES (.igs), and 2D dimensional drawings in DWG or PDF with specified tolerance annotations. Strict NDA signed upon request.
Q4: What is your standard turnaround time for samples and production?
A4: Precision rapid prototyping is completed in 3–7 business days. Production volume runs are typically delivered in 15–25 business days.
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