Detail Information

Material:	AIN Ceramic	Type:	Ceramic Parts
Application:	Industrial Ceramic	Color:	Grey
Size:	Customers' Requests,Size Customized,0.5mm-95mm,According To Your Drawing,OEM	Thermal Conductivity:	170-200 W/mK
Name:	Metallized Ceramic /AIN Substrate,High Temp Alumina Ceramic Setter Plate,Alumina Ceramic Rod,Precision Components In Alumina Ceramic,industrial Ceramic Alumina Ceramic Material Honeycomb Ceramic	Shape:	Rectangle,Square,Sleeve,Tray,Tube
Usage:	Industrial Ceramic,Wear-resisting Material,filter,Industry Usage,ceramic Insulator
Highlight:	Aluminum Nitride Electrical Ceramics , Ceramics Substrate For Semiconductor

Product Description

AlN Aluminum Nitride Electrical Ceramics Substrate for Semiconductor 170 High Thermal Conductivity Heat Sink

As a new generation high thermal conductivity material, aluminum nitride (AlN) ceramic substrate is becoming more and more popular.

This is anideal solution for cooling and packaging of new lED iohting. lae-scale intearated circuits, semiconductor module cicuits and hioh-power devices

Premium Aluminum Nitride Sheets - Superior Thermal Conductivity & Electrical Insulation.

An aerospace-grade ceramic solution, our Aluminum Nitride (AlN) Ceramic Substrate meets the rigorous demands of aerospace electronics.

Industrial control devices operate under high power loads and extreme temperatures, making thermal management essential for reliability.

Our AlN ceramic substrate combines exceptional thermal conductivity with corrosion resistance and electrical insulation, ensuring stable performance in PLCs,

inverters, and industrial sensors. It provides a reliable thermal solution for advanced industrial components, minimizing downtime.

Application 
Aluminum Nitride Sheets – Key Applications:
1. LED Industry: Heat sink substrates for high-power LED chips, improving luminous efficiency and lifespan. 
2. Power Electronics:  Insulating substrates for IGBT modules, SiC/GaN devices, and automotive power control units.
3. Semiconductor Packaging: Chip carriers and package bases for high-frequency and high-reliability ICs. 
4. RF & Microwave Circuits: Low-loss substrates for 5G communications, radar systems, and satellite components. 5: Industrial & Automotive
Heat spreaders in EV battery systems, laser diode coolers, and high-temperature sensor housings.
Performance That Outperforms Alternatives

	
			Item

			Unit

			Reference Value

			Test method

			Thermal conductivity

			 W/m・K

			＞170

			Transient plane source method

			Surface roughness

			μm

			＜0.6

			Stylus surface roughness tester

			Warpage

			 /

			＜2.5‰

			Glass gauge

			Apparent density

			 g/cm3

			≥3.26

			Drainage method

			Bending strength

			 MPa

			＞300

			Three-point bending resistance method

			Volume resistance

			Ω・cm

			 1.5x1013 (TYP)

			Volume resistance gauge

			Dielectric constant

			 @1MHz

			 8.9 (TYP)

			Impedance method

			Dielectric loss

			 @1MHz

			4.6×10-4(TYP)

			Impedance method

			Break down voltage

			 Kv/mm

			36.85(TYP)

			DC power method

			Coefficient of linear expansion

			 1×10-6/℃

			 4.75(TYP)

			Thermomechanical a

Various Types of Aluminum Nitride Sheets

We Can Do OEM and 0BM According to Your Drawing and Requirements.

Exceptional Material Properties:

Technical Superiority 

* High Purity Material: >99% AlN composition with minimal impurities. 

* Advanced Manufacturing: Pressureless sintering technology ensures uniform density.  

* Precision Engineering: ±0.05mm dimensional tolerance guarantee.* Multiple Finishes: As-fired, polished, or metallized surfaces available. 
Quality Certifications  
* ISO 9001:2015 Certified Manufacturing 
* Batch-to-Batch Consistency Guarantee
* Full Traceability Documentation
* RoHS & REACH &CE Compliant
 
Packing 
 
			Hunan Yuanhong New Material Co.,Ltd was established in 2016 ,there are over 100 sets of ceramic professional equipments , several types of furnace in more than 8000 square meters production workshops. ISO9001 certified, a variety of advanced ceramic materials are ROHS and REACH certified.
		
FAQ
Q1. Do you provide product samples? Yes, we provide samples subject to availability. A nominal sample fee may apply in some cases, and shipping costs are borne by the customer.
 
Q2. What are your accepted payment methods? We accept T/T (bank transfer) in advance, Western Union, Alipay, and PayPal.
 
Q3. What is your typical delivery lead time? Lead times vary depending on product requirements, including material selection, dimensions, and specific manufacturing processes.
 
Q4. Do you perform quality inspection before shipment? Yes, we conduct 100% inspection of all goods prior to delivery to ensure they meet specified standards.
 
Q5. What other ceramic materials do you offer? We supply a range of advanced ceramic materials, including Alumina, Zirconia, Aluminum Nitride,Boron Nitride, Silicon Nitride, Machinable Glass Ceramic, and related specialized ceramics.

Tag:

Place of Origin:	China
Brand Name:	YH
Certification:	ISO,CE,Rohs
Model Number:	YH

Minimum Order Quantity:	100
Price:	Negotiated
Packaging Details:	By carton
Delivery Time:	5-30days
Payment Terms:	L/C,T/T,Western Union
Supply Ability:	10000pcs per month

AlN Aluminum Nitride Electrical Ceramics Substrate For Semiconductor High Thermal Conductivity

Aluminum Nitride Electrical Ceramics

Ceramics Substrate For Semiconductor

AlN Aluminum Nitride Electrical Ceramics Substrate for Semiconductor 170 High Thermal Conductivity Heat Sink

As a new generation high thermal conductivity material, aluminum nitride (AlN) ceramic substrate is becoming more and more popular.

This is anideal solution for cooling and packaging of new lED iohting. lae-scale intearated circuits, semiconductor module cicuits and hioh-power devices

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Item	Unit	Reference Value	Test method
Thermal conductivity	W/m・K	＞170	Transient plane source method
Surface roughness	μm	＜0.6	Stylus surface roughness tester
Warpage	/	＜2.5‰	Glass gauge
Apparent density	g/cm³	≥3.26	Drainage method
Bending strength	MPa	＞300	Three-point bending resistance method
Volume resistance	Ω・cm	1.5x10¹³ (TYP)	Volume resistance gauge
Dielectric constant	@1MHz	8.9 (TYP)	Impedance method
Dielectric loss	@1MHz	4.6×10^-4(TYP)	Impedance method
Break down voltage	Kv/mm	36.85(TYP)	DC power method
Coefficient of linear expansion	1×10^-6/℃	4.75(TYP)	Thermomechanical a