| Place of Origin: | China Yixing |
|---|---|
| Brand Name: | HY |
| Certification: | CE |
| Model Number: | HY-DHGJP-1 |
| Minimum Order Quantity: | 10 pieces |
| Price: | Negotiation |
| Packaging Details: | wooden case |
| Delivery Time: | 20-30 working days |
| Payment Terms: | L/C, D/P, T/T, Western Union |
| Supply Ability: | 10000 pcs per weeks |
| Characteristic: | Oil-free Self-lubricating | Product Name: | Silicon Nitride Ceramic Basic Chip |
|---|---|---|---|
| Color: | Black | Bending Strength: | ＞600Mpa |
| Vickers Hardness: | ＞15GPa | Thermal Conductivity: | ＞60W/m.k |
| Size: | Customization | ||
| High Light: | Silicon Nitride alumina based ceramics,alumina based ceramics Anti Rust,Oil Free alumina ceramic |
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silicon nitride ceramics basic chip integrated electronic circuit military technology electric automobile
product name:Silicon nitride ceramic basic chip
Application fields:
The application range of silicon nitride ceramic substrate : heat dissipation substrate, power electronic circuit substrate. It has the characteristics of high strength, high thermal conductivity and high reliability. It can be used to fabricate circuits on the surface by wet etching process. After surface plating, a substrate material for high reliability electronic substrate module packaging is obtained. It is a substrate material for 1681 power control module for new electric vehicles.
In addition, the ceramic substrate industry also involves LED, fine ceramic production, thin film metallization, yellow light micro-shadow, laser molding, electrochemical plating, optical simulation, microelectronic welding and other fields of technology. The products are in the field of high-power optoelectronic and semiconductor devices such as power emitters, photovoltaic devices, IGBTs, modules, power thyristors, resonator bases, semiconductor packaging and loading boards.
Product index :
| characteristic | specification | detecting instrument | |
|
material properties |
Microscopic density | ≥3.22g/cm3 | GB/T1033 |
| bending strength | ＞600MPa | ASTM C1161-2013 | |
| young's modulus | ＞310GPa | ASTM C1259-2014 | |
| vickers hardness | ＞15GPa | ASTM C1327-2015 | |
| fracture toughness | 6.5MPa/√m | ASTM C1421 | |
| thermal conductivity | ＞60W/m.k | 25℃,ASTM D5470 | |
|
thermal expansion coefficient
|
2.6*10-6/k | 40-400℃,ASTM D696 | |
| 2.6*10-6/k | 40-800℃,ASTM 696 | ||
|
electrical properties |
dielectric constant | 7.8 | 1MHz,ASTM D2419 |
| dielectric loss | 4*10-4 | 1MHz,ASTM D2419 | |
| volume resistivity | ＞1014Ω | 25℃,ASTM D2739 | |
| breakdown voltage | ＞15KV/mm | ASTM D149 |
Application fields pictures: